Conference Chairman: Prof. Katsuji Tosha (Meiji University)
Conference Secretary: Dr. Yoshihiro Watanabe (Toyo Seiko Co., Ltd.)
Conference Website: http://www.icsp10.jp
Presentation Schedule (pdf) revised March 4, 2008
Brochure: 2nd Call for Papers
Submission of Abstracts: Deadline, 31, July, 2007
Both oral (15+5 mins) and poster presentations are welcome. Those wishing to present a paper should submit abstracts, preferably in electornic format, as an e-mail attachment to icsp10@isc.meiji.ac.jp
The abstract should not exceed one type-written page of about 1,500 characters. Please use standard symbols and abbreviations only.
Proceedings: Deadline for submission of manuscript, 31, January, 2008.
Papers presented will be published in the Proceedings and will be available at the Conference if the paper is accepted by the ISCSP. Manuscript generally should not exceed 6 pages. Authors who are present at the Conference for either oral or poster presentations and wish to publish their papers in the Proceedings are welcome to submit an abstract.
Conference Language: English
Registration fee is JPY 100,000, including administrative costs, Proceedings, lunches, break refreshments, welcome party, banquet, and plant tour.
Conference Venue: Meiji University Academy Common, 1.5km north of Tokyo station. Nearest station is JR Ochanomizu station. Address: 1-1 Kanda-Surugadai, Chiyoda-ku, Tokyo 101-8301
Conference Hotel: TOKYO GARDEN PALACE Hotel.
Hotel Accomodations and Reservation Form: http://www.icsp10.jp/Accommodations.html
Plant Tour: 16, Sept., 2008
Exhibition: There will be an exhibition of products and services related to the topics of the Conference. Companies and organizations will have an opportunity to exhibit their products on the appropriation floor. For more information, please contact conference secretary.
For more information contact:
Conference Office: Hidero Komada
1-1-1 Higashimita, Tama-ku
Kawasaki, Japan 214-8571
Ph: +81-(0)44-934-7364
Fax: +81-(0)44-934-7907
Email: icsp10@isc.meiji.ac.jp

Applications: Automotive, Aerospace, Energy and Reactor technology, Welding structures, Offshore applications, and others

Modelling and Simulation: Process simulation, Life time prediction, Simulation of surface characteristics

Alternative Processes: Deep rolling, laser peening, Ultrasonic peening, and others

Fatigue and Fracture of Other Materials: Room termperature, High termperatures, Corrosion and fretting resistance

Technological Aspect: Machine and media, Specifications, Techniques, Devices and Equipment, Process control

Surface Characteristics: Measurement and stability of residual stresses and related standards, Measurement and stability of other surface characteristics

Cavitation Peening: Effect, Application, Devices and Equipment

Fine Particle Peening: Fine particle bombarding process, Effect Application, Devices and Equipment

Presentation Schedule-pdf (2008/3/4)

July 31, 2007: Deadline for Abstracts

January 31, 2008: Deadline for submission of Manuscript

July 31, 2008 : Deadline for Registration

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